Services

image171

Micro-marking on many materials

 

Direct write laser marking of text, graphics and Data Matrix 2D barcodes on many substrates.  Excimer lasers can be used on diamond and FUSED SILICA for cleaning and ablation.  The UV wavelength is guaranteed not to crack or fracture the material.  The laser mark was made using a 2 um spot size at the work surface and the 'Engineering' text height is 30 microns.  NOTE: The overlaying squares are TeoSys's proprietary focusing aide which is part of the visible beam path and coaxial (merged) with the UV beam path. 

image172

Laser Hole Drilling

Hole drilling up to 1mm through many substrates using 193nm with little to no taper due to our patented OEM Excimer laser. The picture to the right is a 3.6 micron hole drilled through a 500um glass substrate using our OEM Excimer laser at 193nm. 

5 microns of teflon ablated from around the circumference of a 15 micron diameter copper wire

Laser Ablation

We can ablate a specific 2-50 micron material without damage to the underlying substrate. The material may be any shape as our motion control and custom fixturing allows us to move the material as needed. The picture shows 5 microns of teflon ablated from around the circumference of a 15 micron diameter copper wire