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Direct write laser marking of text, graphics and Data Matrix 2D barcodes on many substrates. Excimer lasers can be used on diamond and FUSED SILICA for cleaning and ablation. The UV wavelength is guaranteed not to crack or fracture the material. The laser mark was made using a 2 um spot size at the work surface and the 'Engineering' text height is 30 microns. NOTE: The overlaying squares are TeoSys's proprietary focusing aide which is part of the visible beam path and coaxial (merged) with the UV beam path.
We can ablate a specific 2-50 micron material without damage to the underlying substrate. The material may be any shape as our motion control and custom fixturing allows us to move the material as needed. The picture shows 5 microns of teflon ablated from around the circumference of a 15 micron diameter copper wire